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Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Memory bandwidth supported by processor (max) | 93.85 GB/s |
Thermal Design Power (TDP) | 165 W |
Processor cache | 19.25 MB |
Processor ARK ID | 198016 |
Processor model | W-2255 |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon W |
Processor cores | 10 |
Box | No |
Processor socket | LGA 2066 (Socket R4) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 93.85 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 1S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Physical Address Extension (PAE) | 46 bit |
Market segment | Workstation |
Launch date | Q4'19 |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 45mm x 52.5mm |
Processor ARK ID | 198016 |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 1S |
Physical Address Extension (PAE) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Workstation |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Memory Protection Extensions (Intel® MPX) | Yes |
Intel® Optane™ Memory Ready | No |
Intel® OS Guard | Yes |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.7 GHz |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 62 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 45mm x 52.5mm |
Other features | |
Maximum internal memory | 1 TB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Memory bandwidth supported by processor (max) | 93.85 GB/s |
Thermal Design Power (TDP) | 165 W |
Processor cache | 19.25 MB |
Processor ARK ID | 198016 |
Processor model | W-2255 |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon W |
Processor cores | 10 |
Box | No |
Processor socket | LGA 2066 (Socket R4) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 93.85 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 1S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Physical Address Extension (PAE) | 46 bit |
Market segment | Workstation |
Launch date | Q4'19 |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 165 W |
Processor package size | 45mm x 52.5mm |
Processor ARK ID | 198016 |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 1S |
Physical Address Extension (PAE) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Workstation |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | No |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Speed Shift Technology | Yes |
Intel® Memory Protection Extensions (Intel® MPX) | Yes |
Intel® Optane™ Memory Ready | No |
Intel® OS Guard | Yes |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Boot Guard | Yes |
Intel® Volume Management Device (VMD) | Yes |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.7 GHz |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 62 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 45mm x 52.5mm |
Other features | |
Maximum internal memory | 1 TB |
CPU configuration (max) | 1 |
Save £466.95
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Number of QPI links | 2 |
Bus type | UPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | No |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | No |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |
Other features | |
Compatibility | ThinkSystem SR550/SR590/SR650 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Number of QPI links | 2 |
Bus type | UPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | No |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76 x 56.5 mm |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | No |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76 x 56.5 mm |
Other features | |
Compatibility | ThinkSystem SR550/SR590/SR650 |
Save £272.59
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Comet Lake |
Configurable TDP-down | 95 W |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 125 W |
Processor cache | 20 MB |
Processor ARK ID | 199331 |
Processor model | i9-10900KF |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Configurable TDP-down frequency | 3.3 GHz |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 95 W |
Thermal Design Power (TDP) | 125 W |
Configurable TDP-down frequency | 3.3 GHz |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015D |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 125 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Configurable TDP-down frequency | 3.3 GHz |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 125 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199331 |
Thermal solution specification | PCG 2015D |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5.1 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.3 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Comet Lake |
Configurable TDP-down | 95 W |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 125 W |
Processor cache | 20 MB |
Processor ARK ID | 199331 |
Processor model | i9-10900KF |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.3 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Configurable TDP-down frequency | 3.3 GHz |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Configurable TDP-down | 95 W |
Thermal Design Power (TDP) | 125 W |
Configurable TDP-down frequency | 3.3 GHz |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015D |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 125 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Configurable TDP-down frequency | 3.3 GHz |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 125 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199331 |
Thermal solution specification | PCG 2015D |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5.1 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.2 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.3 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £91.03
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Save £456.89
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76.0 x 56.5 mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX, AVX 2.0, AVX-512, SSE4.2 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Operational conditions | |
Tcase | 84 °C |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76.0 x 56.5 mm |
Save £305.56
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 20 MB |
Processor ARK ID | 199329 |
Processor model | i9-10900F |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199329 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.1 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.2 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 2.8 GHz |
Processor manufacturer | Intel |
Cooler included | Yes |
Processor codename | Comet Lake |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Thermal Design Power (TDP) | 65 W |
Processor cache | 20 MB |
Processor ARK ID | 199329 |
Processor model | i9-10900F |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 5.2 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 |
Processor cores | 10 |
Box | Yes |
Processor socket | LGA 1200 (Socket H5) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 128 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 45.8 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Dual-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 65 W |
Technical details | |
Intel Stable Image Platform Program (SIPP) | No |
Thermal solution specification | PCG 2015C |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 65 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q2'20 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 128 GB |
Bus speed | 8 GT/s |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 16 |
Thermal Design Power (TDP) | 65 W |
Processor package size | 37.5 x 37.5 mm |
Processor ARK ID | 199329 |
Thermal solution specification | PCG 2015C |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
PCI Express configurations | 1x16, 2x8, 1x8+2x4 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Software Guard Extensions (Intel SGX) | Yes |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® OS Guard | Yes |
Intel Stable Image Platform Program (SIPP) | No |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | No |
Intel® Identity Protection Technology (Intel® IPT) | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® Boot Guard | Yes |
Intel® Thermal Velocity Boost | Yes |
Intel® vPro™ Platform Eligibility | No |
Intel® Turbo Boost Technology 2.0 frequency | 5 GHz |
Intel® Turbo Boost Max Technology 3.0 frequency | 5.1 GHz |
Intel® Transactional Synchronization Extensions | No |
Intel® Thermal Velocity Boost Temperature | 70 °C |
Intel® Thermal Velocity Boost Frequency | 5.2 GHz |
Operational conditions | |
Tjunction | 100 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 37.5 x 37.5 mm |
Other features | |
Maximum internal memory | 128 GB |
CPU configuration (max) | 1 |
Save £100.59
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £557.58
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £277.82
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Memory bandwidth supported by processor (max) | 94 GB/s |
Thermal Design Power (TDP) | 165 W |
Processor cache | 19.25 MB |
Processor ARK ID | 198019 |
Processor model | i9-10900X |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 X-series |
Processor cores | 10 |
Box | No |
Processor socket | LGA 2066 (Socket R4) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 256 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 94 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Quad-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Thermal solution specification | PCG 2017X |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'19 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 256 GB |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s DMI3 |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 165 W |
Processor ARK ID | 198019 |
Thermal solution specification | PCG 2017X |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.7 GHz |
Operational conditions | |
Tjunction | 94 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Other features | |
Maximum internal memory | 256 GB |
CPU configuration (max) | 1 |
Processor | |
---|---|
Processor generation | 10th gen Intel® Core™ i9 |
Processor base frequency | 3.7 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Memory bandwidth supported by processor (max) | 94 GB/s |
Thermal Design Power (TDP) | 165 W |
Processor cache | 19.25 MB |
Processor ARK ID | 198019 |
Processor model | i9-10900X |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 4.5 GHz |
Component for | PC |
Processor lithography | 14 nm |
Processor family | Intel® Core™ i9 X-series |
Processor cores | 10 |
Box | No |
Processor socket | LGA 2066 (Socket R4) |
Processor cache type | Smart Cache |
Generation | 10th Generation |
Memory | |
Maximum internal memory supported by processor | 256 GB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2933 MHz |
Memory bandwidth supported by processor (max) | 94 GB/s |
Supported memory types | DDR4-SDRAM |
Memory channels | Quad-channel |
ECC | No |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 165 W |
Technical details | |
Thermal solution specification | PCG 2017X |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 165 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Desktop |
Launch date | Q4'19 |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Maximum memory | 256 GB |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Bus speed | 8 GT/s DMI3 |
Target market | Gaming, Content Creation |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 165 W |
Processor ARK ID | 198019 |
Thermal solution specification | PCG 2017X |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.1, SSE4.2, AVX 2.0, AVX-512 |
Scalability | 1S |
Embedded options available | No |
CPU configuration (max) | 1 |
Market segment | Desktop |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | Yes |
Intel® Optane™ Memory Ready | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 2 |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Intel® Turbo Boost Max Technology 3.0 frequency | 4.7 GHz |
Operational conditions | |
Tjunction | 94 °C |
Packaging data | |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Other features | |
Maximum internal memory | 256 GB |
CPU configuration (max) | 1 |
Save £208.27
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | No |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 84 °C |
Packaging data | |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Other features | |
Maximum internal memory | 1 TB |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor ARK ID | 197098 |
Processor model | 4210R |
Processor threads | 20 |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Supported memory types | DDR4-SDRAM |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Embedded options available | Yes |
Product type | Processor |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 100 W |
Supported memory types | DDR4-SDRAM |
Status | Launched |
Market segment | Server |
Launch date | Q1'20 |
Intel Virtualization Technology (VT-x) | Yes |
Number of UPI links | 2 |
Memory speed (max) | 2400 MHz |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Servicing status | Baseline Servicing |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
Processor package size | 76mm x 56.5mm |
Processor ARK ID | 197098 |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | SSE4.2, AVX, AVX 2.0, AVX-512 |
Scalability | 2S |
Embedded options available | Yes |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Export Control Classification Number (ECCN) | 5A992C |
Commodity Classification Automated Tracking System (CCATS) | G077159 |
PCI Express CEM revision | 3.0 |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel Turbo Boost Max Technology 3.0 | No |
Intel® Speed Shift Technology | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Virtualization Technology (VT-x) | Yes |
AVX-512 Fused Multiply-Add (FMA) units | 1 |
Intel® Volume Management Device (VMD) | Yes |
Intel® Speed Select technology - Performance Profile (Intel® SST-PP) | No |
Intel® Optane™ DC Persistent Memory Supported | No |
Intel® Deep Learning Boost (Intel® DL Boost) | Yes |
Mode-based Execute Control (MBE) | Yes |
Intel® Run Sure Technology | No |
Intel® Resource Director Technology (Intel® RDT) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Intel® Speed Select Technology - Base Frequency (Intel® SST-BF) | No |
Intel® Optane™ DC Persistent Memory technology | No |
Intel Speed Select Technology (SST) | No |
Intel® Transactional Synchronization Extensions | Yes |
Operational conditions | |
Tcase | 84 °C |
Packaging data | |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Package type | Retail box |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Weight & dimensions | |
Processor package size | 76mm x 56.5mm |
Package width | 43 mm |
Package depth | 137 mm |
Package height | 112 mm |
Other features | |
Maximum internal memory | 1 TB |
Save £275.77
Processor | |
---|---|
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Broadwell |
Memory bandwidth supported by processor (max) | 68.3 GB/s |
Thermal Design Power (TDP) | 85 W |
Processor cache | 25 MB |
Processor model | E5-2630V4 |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.1 GHz |
Stepping | R0 |
Number of QPI links | 2 |
Bus type | QPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® E5 v4 |
Processor cores | 10 |
Processor socket | LGA 2011-v3 |
Processor series | Intel Xeon E5-2600 v4 |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 1.54 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 1600,1866,2133 MHz |
Memory bandwidth supported by processor (max) | 68.3 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX 2.0 |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | No |
CPU configuration (max) | 2 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 85 W |
Processor series | Intel Xeon E5-2600 v4 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 40 |
Thermal Design Power (TDP) | 85 W |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX 2.0 |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Embedded options available | No |
CPU configuration (max) | 2 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® OS Guard | Yes |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 74 °C |
Other features | |
CPU configuration (max) | 2 |
Processor | |
---|---|
Processor base frequency | 2.2 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Broadwell |
Memory bandwidth supported by processor (max) | 68.3 GB/s |
Thermal Design Power (TDP) | 85 W |
Processor cache | 25 MB |
Processor model | E5-2630V4 |
Processor threads | 20 |
System bus rate | 8 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.1 GHz |
Stepping | R0 |
Number of QPI links | 2 |
Bus type | QPI |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel® Xeon® E5 v4 |
Processor cores | 10 |
Processor socket | LGA 2011-v3 |
Processor series | Intel Xeon E5-2600 v4 |
Processor cache type | Smart Cache |
Memory | |
Maximum internal memory supported by processor | 1.54 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 1600,1866,2133 MHz |
Memory bandwidth supported by processor (max) | 68.3 GB/s |
Memory channels | Quad-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 85 W |
Technical details | |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Thermal Monitoring Technologies | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
Enhanced Intel SpeedStep Technology | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX 2.0 |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Embedded options available | No |
CPU configuration (max) | 2 |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Thermal Design Power (TDP) | 85 W |
Processor series | Intel Xeon E5-2600 v4 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Server |
Intel Virtualization Technology (VT-x) | Yes |
Processor cache type | Smart Cache |
Features | |
Maximum number of PCI Express lanes | 40 |
Thermal Design Power (TDP) | 85 W |
Thermal Monitoring Technologies | Yes |
Idle States | Yes |
Execute Disable Bit | Yes |
PCI Express slots version | 3.0 |
Supported instruction sets | AVX 2.0 |
Scalability | 2S |
Physical Address Extension (PAE) | Yes |
Embedded options available | No |
CPU configuration (max) | 2 |
Physical Address Extension (PAE) | 46 bit |
Market segment | Server |
Processor special features | |
Intel Virtualization Technology for Directed I/O (VT-d) | Yes |
Intel 64 | Yes |
Intel® OS Guard | Yes |
Intel TSX-NI | Yes |
Intel® Secure Key | Yes |
Intel® Turbo Boost Technology | 2.0 |
Intel Trusted Execution Technology | Yes |
Intel® Identity Protection Technology (Intel® IPT) | No |
Intel® Hyper Threading Technology (Intel® HT Technology) | Yes |
Intel Flex Memory Access | No |
Intel® AES New Instructions (Intel® AES-NI) | Yes |
Enhanced Intel SpeedStep Technology | Yes |
Intel VT-x with Extended Page Tables (EPT) | Yes |
Intel Demand Based Switching | Yes |
Intel Virtualization Technology (VT-x) | Yes |
Intel® vPro™ Platform Eligibility | Yes |
Operational conditions | |
Tcase | 74 °C |
Other features | |
CPU configuration (max) | 2 |
Save £1,097.47
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Processor | |
---|---|
Processor generation | 2nd Generation Intel® Xeon® Scalable |
Processor base frequency | 2.4 GHz |
Processor manufacturer | Intel |
Cooler included | No |
Processor codename | Cascade Lake |
Thermal Design Power (TDP) | 100 W |
Processor cache | 13.75 MB |
Processor model | 4210R |
Processor threads | 20 |
System bus rate | 9.6 GT/s |
Processor operating modes | 64-bit |
Processor boost frequency | 3.2 GHz |
Component for | Server/workstation |
Processor lithography | 14 nm |
Processor family | Intel Xeon Silver |
Processor cores | 10 |
Box | No |
Processor socket | LGA 3647 (Socket P) |
Processor cache type | L3 |
Memory | |
Maximum internal memory supported by processor | 1.02 TB |
Memory types supported by processor | DDR4-SDRAM |
Memory clock speeds supported by processor | 2400 MHz |
Memory channels | Hexa-channel |
ECC | Yes |
Graphics | |
Discrete graphics card | No |
On-board graphics card model | Not available |
On-board graphics card | No |
Discrete graphics card model | Not available |
Power | |
Thermal Design Power (TDP) | 100 W |
Technical details | |
PCI Express slots version | 3.0 |
Scalability | 2S |
Thermal Design Power (TDP) | 100 W |
Market segment | Server |
Processor cache type | L3 |
Features | |
Maximum number of PCI Express lanes | 48 |
Thermal Design Power (TDP) | 100 W |
PCI Express slots version | 3.0 |
Scalability | 2S |
Market segment | Server |
Harmonized System (HS) code | 85423119 |
Logistics data | |
Harmonized System (HS) code | 85423119 |
Save £418.88
Save £45.28