Name: Team Group ELITE TED532G5200C4201 memory module 32 GB 1 x 32 GB DDR5 5200 MHz
Brand: Team Group
SKU: TED532G5200C4201
Price: 90.22 GBP
Availability: InStock

Kingston Technology FURY Beast 32GB 5200MT/s DDR5 CL36 DIMM White EXPO

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Kingston Technology FURY Beast 32GB 6000MT/s DDR5 CL40 DIMM White XMP

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DELL AC480748 memory module 32 GB 1 x 32 GB DDR5 5200 MHz

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V7 V74480032GBD memory module 32 GB 1 x 32 GB DDR5 5600 MHz

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Patriot Memory Signature PSD532G56002 memory module 32 GB 1 x 32 GB DDR5 5600 MHz

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Team Group ELITE TED532G5200C4201 memory module 32 GB 1 x 32 GB DDR5 5200 MHz

£90.22

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Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	36
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
AMD Extended Profiles for Overclocking (EXPO) version	1.0
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	5200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	White
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Product colour	White
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	38.6 g
Package weight	54.1 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	54.1 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.5 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

Design
Compatible products	Alienware Aurora R15 (Intel)
Technical details
Chips organisation	2Rx8
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
ECC	No
Memory clock speed	5200 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Compatible products	Alienware Aurora R15 (Intel)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
ECC	No
Memory clock speed	5200 MHz
Internal memory type	DDR5
Other features
Chips organisation	2Rx8

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Power
Memory voltage	1.1 V
Design
Certification	CE, RoHS
Technical details
Country of origin	China
Sustainability compliance	Yes
Sustainability certificates	CE, RoHS
Compliance certificates	CE, RoHS
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Memory ranking	2
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Features
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
Country of origin	China
Certification	CE, RoHS
Memory ranking	2
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Certificates
Certification	CE, RoHS
Sustainability
Sustainability compliance	Yes
Sustainability certificates	CE, RoHS
Weight & dimensions
Package width	110 mm
Package depth	170 mm
Package height	15 mm
Width	110 mm
Depth	170 mm
Height	15 mm
Weight	65 g
Package weight	70 g
Packaging data
Package width	110 mm
Package depth	170 mm
Package height	15 mm
Package weight	70 g
Other features
Country of origin	China

Memory
Package type	Blister
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Power
Memory voltage	1.1 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	1 x 32 GB
Internal memory	32 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	46
Memory voltage	1.1 V
ECC	No
Memory clock speed	5600 MHz
Internal memory type	DDR5
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Technical details
Sustainability certificates	RoHS
Compliance certificates	RoHS
Sustainability
Sustainability certificates	RoHS
Weight & dimensions
Package width	61 mm
Package depth	12 mm
Package height	170 mm
Width	133 mm
Depth	2 mm
Height	32 mm
Weight	17 g
Package type	Blister
Package weight	29 g
Packaging data
Package width	61 mm
Package depth	12 mm
Package height	170 mm
Package type	Blister
Package weight	29 g

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