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Power | |
---|---|
Memory voltage | 1.1 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.1 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 15.8 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.1 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 29.12 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 4800 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £135.78
Power | |
---|---|
Memory voltage | 1.35 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.35 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 32 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 6000 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £244.63
Power | |
---|---|
Memory voltage | 1.25 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.25 V |
Design | |
Product colour | Black |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Product colour | Black |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Compliance certificates | RoHS |
Memory | |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
Features | |
On-Die ECC | Yes |
Buffered memory type | Registered (buffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 3.0 |
Row Precharge Time (TRP) | 16 |
Product colour | Black |
Memory layout (modules x size) | 4 x 16 GB |
Internal memory | 64 GB |
Component for | PC |
Memory form factor | 288-pin DIMM |
CAS latency | 36 |
Memory voltage | 1.25 V |
Lead plating | Gold |
Module configuration | 2048M x 80 |
Row cycle time | 48 ns |
Refresh row cycle time | 295 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory channels | Quad-channel |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | Yes |
Internal memory type | DDR5 |
Programming power voltage (VPP) | 1.8 V |
JEDEC standard | Yes |
Memory data transfer rate | 5600 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 95 °C |
Storage temperature (T-T) | -55 - 100 °C |
Sustainability | |
Sustainability certificates | RoHS |
Doesn't contain | Halogen |
Weight & dimensions | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Width | 133.3 mm |
Depth | 3.8 mm |
Height | 31.2 mm |
Weight | 76.67 g |
Package weight | 109.34 g |
Packaging data | |
Package width | 104.1 mm |
Package depth | 167.6 mm |
Package height | 35.6 mm |
Package weight | 109.34 g |
Logistics data | |
Master (outer) case width | 207 mm |
Master (outer) case length | 469.9 mm |
Master (outer) case height | 105.4 mm |
Master (outer) case gross weight | 1.45 kg |
Products per master (outer) case | 10 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £213.50
Save £45.28