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Memory Modules
-
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| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade RGB
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight colour | Red/Green/Blue |
| Backlight | Yes |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 70 °C |
| Storage temperature (T-T) | -40 - 85 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£575.83
£479.86 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 3200MT/s DDR4 CL16 DIMM (Kit of 8) Renegade Black
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| On-Die ECC | No |
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Backlight | No |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 16 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Width | 8.1 mm |
| Depth | 133.2 mm |
| Height | 42.9 mm |
| Weight | 421.22 g |
| Package weight | 626.54 g |
| Packaging data |
|---|
| Package width | 122.2 mm |
| Package depth | 73.7 mm |
| Package height | 171.5 mm |
| Package weight | 626.54 g |
| Logistics data |
|---|
| Master (outer) case width | 190.5 mm |
| Master (outer) case length | 254 mm |
| Master (outer) case height | 177.8 mm |
| Master (outer) case gross weight | 2.06 kg |
| Products per master (outer) case | 3 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£527.34
£439.45 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| Module configuration | 4096M x 80 |
| Row cycle time | 48 ns |
| Refresh row cycle time | 295 ns |
| Row active time | 32 ns |
| SPD profile | Yes |
| Memory channels | Dual-channel |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | Yes |
| Internal memory type | DDR5 |
| Programming power voltage (VPP) | 1.8 V |
| JEDEC standard | Yes |
| Memory data transfer rate | 6000 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,341.26
£1,117.72RRP £1,743.65Save £625.92
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 5600MT/s DDR5 ECC Reg CL28 DIMM (Kit of 8) Renegade Pro EXPO
| Power |
|---|
| Memory voltage | 1.25 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 28 |
| Memory voltage | 1.25 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 5600 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,220.96
£1,017.47RRP £1,556.73Save £539.26
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6000MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO
| Power |
|---|
| Memory voltage | 1.35 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.35 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6000 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,295.89
£1,079.91RRP £1,652.26Save £572.35
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro EXPO
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| AMD Extended Profiles for Overclocking (EXPO) version | 1.1 |
| AMD Extended Profiles for Overclocking (EXPO) | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,540.56
£1,283.80RRP £2,041.24Save £757.44
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6400MT/s DDR5 ECC Reg CL32 DIMM (Kit of 8) Renegade Pro XMP
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 32 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6400 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,540.56
£1,283.80RRP £2,118.26Save £834.47
In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
Kingston Technology FURY 256GB 6800MT/s DDR5 ECC Reg CL34 DIMM (Kit of 8) Renegade Pro XMP
| Power |
|---|
| Memory voltage | 1.4 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| Features |
|---|
| On-Die ECC | Yes |
| Buffered memory type | Registered (buffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 3.0 |
| Product colour | Black |
| Memory layout (modules x size) | 8 x 32 GB |
| Internal memory | 256 GB |
| Component for | PC/Server |
| Memory form factor | 288-pin DIMM |
| CAS latency | 34 |
| Memory voltage | 1.4 V |
| Lead plating | Gold |
| SPD profile | Yes |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| ECC | Yes |
| Memory clock speed | 6800 MHz |
| Internal memory type | DDR5 |
| JEDEC standard | Yes |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 95 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability compliance | Yes |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Width | 31.2 mm |
| Depth | 133.3 mm |
| Height | 3.8 mm |
| Weight | 153.33 g |
| Package weight | 186.01 g |
| Packaging data |
|---|
| Package width | 104.1 mm |
| Package depth | 167.6 mm |
| Package height | 35.6 mm |
| Package weight | 186.01 g |
| Logistics data |
|---|
| Master (outer) case width | 207 mm |
| Master (outer) case length | 469.9 mm |
| Master (outer) case height | 105.4 mm |
| Master (outer) case gross weight | 2.21 kg |
| Products per master (outer) case | 10 pc(s) |
| Other features |
|---|
| Country of origin | China, Taiwan |
£1,839.34
£1,532.78RRP £2,191.87Save £659.09
In stock
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