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Power | |
---|---|
Memory voltage | 1.35 V |
Design | |
Cooling type | Heatsink |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3733 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 7.1 mm |
Depth | 113.4 mm |
Height | 34 mm |
Weight | 36.05 g |
Package weight | 51.6 g |
Packaging data | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 51.6 g |
Logistics data | |
Master (outer) case width | 196.9 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 61 mm |
Master (outer) case gross weight | 1.43 kg |
Products per master (outer) case | 25 pc(s) |
Shipping (inner) case width | 19.7 cm |
Shipping (inner) case length | 31.1 cm |
Shipping (inner) case height | 6.1 cm |
Products per shipping (inner) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features | |
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Power | |
---|---|
Memory voltage | 1.35 V |
Design | |
Cooling type | Heatsink |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3733 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 7.1 mm |
Depth | 113.4 mm |
Height | 34 mm |
Weight | 36.05 g |
Package weight | 51.6 g |
Packaging data | |
Package width | 57.2 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 51.6 g |
Logistics data | |
Master (outer) case width | 196.9 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 61 mm |
Master (outer) case gross weight | 1.43 kg |
Products per master (outer) case | 25 pc(s) |
Shipping (inner) case width | 19.7 cm |
Shipping (inner) case length | 31.1 cm |
Shipping (inner) case height | 6.1 cm |
Products per shipping (inner) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features | |
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Save £12.04
Power | |
---|---|
Memory voltage | 1.2,1.35 V |
Design | |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.2,1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.2,1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3733 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions | |
Package width | 63.5 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 7.1 mm |
Depth | 133.4 mm |
Height | 41.1 mm |
Weight | 38.8 g |
Package weight | 57.7 g |
Packaging data | |
Package width | 63.5 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 57.7 g |
Logistics data | |
Master (outer) case width | 193 mm |
Master (outer) case length | 325.1 mm |
Master (outer) case height | 88.9 mm |
Master (outer) case gross weight | 1.68 kg |
Products per master (outer) case | 25 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Power | |
---|---|
Memory voltage | 1.2,1.35 V |
Design | |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details | |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.2,1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features | |
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight colour | Red/Green/Blue |
Backlight | Yes |
Memory layout (modules x size) | 1 x 8 GB |
Internal memory | 8 GB |
Component for | PC/Server |
Memory form factor | 288-pin DIMM |
CAS latency | 19 |
Memory voltage | 1.2,1.35 V |
Lead plating | Gold |
Module configuration | 1024M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 32 ns |
SPD profile | Yes |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 1 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Memory data transfer rate | 3733 MT/s |
Operational conditions | |
Operating temperature (T-T) | 0 - 70 °C |
Storage temperature (T-T) | -40 - 85 °C |
Weight & dimensions | |
Package width | 63.5 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 7.1 mm |
Depth | 133.4 mm |
Height | 41.1 mm |
Weight | 38.8 g |
Package weight | 57.7 g |
Packaging data | |
Package width | 63.5 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 57.7 g |
Logistics data | |
Master (outer) case width | 193 mm |
Master (outer) case length | 325.1 mm |
Master (outer) case height | 88.9 mm |
Master (outer) case gross weight | 1.68 kg |
Products per master (outer) case | 25 pc(s) |
Other features | |
Country of origin | China, Taiwan |
Save £21.06
Save £45.28