Name: Kingston Technology FURY 16GB 3733MT/s DDR4 CL19 DIMM 1Gx8 Beast RGB
Brand: Kingston Technology
SKU: KF437C19BB12A/16
Price: 58.48 GBP
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Kingston Technology FURY 16GB 3733MT/s DDR4 CL19 DIMM 1Gx8 Beast Black

£58.24

RRP £69.39

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Kingston Technology FURY 8GB 3733MT/s DDR4 CL19 DIMM Beast Black

£32.82

RRP £44.58

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Kingston Technology FURY 16GB 3733MT/s DDR4 CL19 DIMM (Kit of 2) Beast Black

£62.15

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Kingston Technology FURY 32GB 3733MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Beast Black

£97.30

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Kingston Technology FURY 16GB 3733MT/s DDR4 CL19 DIMM (Kit of 2) Beast RGB

£67.66

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Kingston Technology FURY 32GB 3733MT/s DDR4 CL19 DIMM (Kit of 2) 1Gx8 Beast RGB

£115.91

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Kingston Technology FURY 8GB 3733MT/s DDR4 CL19 DIMM Beast RGB

£42.84

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Kingston Technology FURY 16GB 3733MT/s DDR4 CL19 DIMM 1Gx8 Beast RGB

£58.48

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Special Deal

Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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Availability 132 In stock/43 sold

Free Standard Delivery or Express Delivery By Monday 1st July

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Memory ranking	2
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Memory ranking	2
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 16 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Memory ranking	1
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Memory ranking	1
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.2,1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.2,1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.2,1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3733 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	41.1 mm
Weight	77.9 g
Package weight	120.5 g
Packaging data
Package width	121.9 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	120.5 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	88.9 mm
Master (outer) case gross weight	1.39 kg
Products per master (outer) case	10 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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