Name: Kingston Technology FURY Renegade RGB memory module 8 GB 1 x 8 GB DDR4 3600 MHz
Brand: Kingston Technology
SKU: KF436C16RBA/8
Price: 43.12 GBP
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Kingston Technology FURY 8GB 3600MT/s DDR4 CL17 DIMM Beast Black

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Kingston Technology FURY 8GB 3600MT/s DDR4 CL17 DIMM Beast White RGB SE

£36.40

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Kingston Technology FURY 8GB 3600MT/s DDR4 CL17 DIMM Beast RGB

£35.51

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Kingston Technology FURY 8GB 3600MT/s DDR4 CL16 DIMM Renegade RGB

£43.12

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Kingston Technology FURY 8GB 3600MT/s DDR4 CL16 DIMM Renegade Black

£32.82

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Kingston Technology FURY Renegade RGB memory module 8 GB 1 x 8 GB DDR4 3600 MHz

£43.12

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Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Memory ranking	1
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Memory ranking	1
ECC	No
Internal memory type	DDR4
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Harmonized System (HS) code	84733020
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	36.05 g
Package weight	51.6 g
Packaging data
Package width	57.2 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	51.6 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	311.2 mm
Master (outer) case height	61 mm
Master (outer) case gross weight	1.43 kg
Products per master (outer) case	25 pc(s)
Shipping (inner) case width	19.7 cm
Shipping (inner) case length	31.1 cm
Shipping (inner) case height	6.1 cm
Products per shipping (inner) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Width	8.1 mm
Depth	133.3 mm
Height	45.8 mm
Weight	54.27 g
Package weight	82.35 g
Packaging data
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Package weight	82.35 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	235 mm
Master (outer) case height	152.4 mm
Master (outer) case gross weight	1.4 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	White
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Product colour	White
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Width	8.1 mm
Depth	133.3 mm
Height	45.8 mm
Weight	54.27 g
Package weight	82.35 g
Packaging data
Package width	177.8 mm
Package depth	14 mm
Package height	137.2 mm
Package weight	82.35 g
Logistics data
Master (outer) case width	196.9 mm
Master (outer) case length	235 mm
Master (outer) case height	152.4 mm
Master (outer) case gross weight	1.4 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	17
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Package width	63.5 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	133.4 mm
Height	41.1 mm
Weight	38.8 g
Package weight	57.7 g
Packaging data
Package width	63.5 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	57.7 g
Logistics data
Master (outer) case width	193 mm
Master (outer) case length	325.1 mm
Master (outer) case height	88.9 mm
Master (outer) case gross weight	1.68 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

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Memory
Package type	Box
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Power
Memory voltage	1.35 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	1 x 8 GB
Internal memory	8 GB
Component for	PC
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Memory data transfer rate	3600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	133.3 mm
Depth	8.29 mm
Height	42 mm
Weight	52.67 g
Package type	Box
Package weight	104.29 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package type	Box
Package weight	104.29 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.75 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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