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Memory Modules
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Power |
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Memory voltage | 1.2 V |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Lead plating | Gold |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
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Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Lead plating | Gold |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Logistics data |
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Harmonized System (HS) code | 84733020 |
Other features |
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Harmonized System (HS) code | 84733020 |
Crucial CT2K32G4SFD832A memory module 64 GB 2 x 32 GB DDR4 3200 MHz Power |
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Memory voltage | 1.2 V |
Memory |
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Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Lead plating | Gold |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Buffered memory type | Unregistered (unbuffered) |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
Lead plating | Gold |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Logistics data |
---|
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
£137.08
£114.23 In stock
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Power |
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Memory voltage | 1.2 V |
Design |
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Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
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Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
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Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
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Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
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Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
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Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
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Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
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Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
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Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 64GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact Power |
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Memory voltage | 1.2 V |
Design |
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Backlight | No |
Cooling type | Heatsink |
JEDEC standard | Yes |
Technical details |
---|
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory |
---|
Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
Features |
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Buffered memory type | Unregistered (unbuffered) |
Intel Extreme Memory Profile (XMP) | Yes |
Intel Extreme Memory Profile (XMP) version | 2.0 |
Backlight | No |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 20 |
Memory voltage | 1.2 V |
Module configuration | 4096M x 64 |
Row cycle time | 45.75 ns |
Refresh row cycle time | 350 ns |
Row active time | 26.25 ns |
Country of origin | China, Taiwan |
Cooling type | Heatsink |
Memory ranking | 2 |
ECC | No |
Internal memory type | DDR4 |
Programming power voltage (VPP) | 2.5 V |
JEDEC standard | Yes |
Harmonized System (HS) code | 84733020 |
Memory data transfer rate | 3200 MT/s |
Operational conditions |
---|
Operating temperature (T-T) | 0 - 85 °C |
Storage temperature (T-T) | -55 - 100 °C |
Weight & dimensions |
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Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Width | 3.8 mm |
Depth | 69.6 mm |
Height | 30 mm |
Weight | 15.2 g |
Package weight | 40.3 g |
Packaging data |
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Package width | 95.3 mm |
Package depth | 14 mm |
Package height | 171.5 mm |
Package weight | 40.3 g |
Logistics data |
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Master (outer) case width | 203.2 mm |
Master (outer) case length | 311.2 mm |
Master (outer) case height | 101.6 mm |
Master (outer) case gross weight | 1.22 kg |
Products per master (outer) case | 25 pc(s) |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Country of origin | China, Taiwan |
Harmonized System (HS) code | 84733020 |
£127.63
£106.36 In stock
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Power |
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Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
Technical details |
---|
Cooling type | Heatsink |
Memory |
---|
SPD speed | 3200 MHz |
SPD voltage | 1.2 V |
SPD latency | 22 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Notebook |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
SPD profile | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
SPD speed | 3200 MHz |
Backlight | No |
SPD voltage | 1.2 V |
SPD latency | 22 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Notebook |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
SPD profile | Yes |
Cooling type | Heatsink |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
Corsair Vengeance CMSX64GX4M2A3200C22 memory module 64 GB 2 x 32 GB DDR4 3200 MHz Power |
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Memory voltage | 1.2 V |
Design |
---|
Backlight | No |
Cooling type | Heatsink |
Technical details |
---|
Cooling type | Heatsink |
Memory |
---|
SPD speed | 3200 MHz |
SPD voltage | 1.2 V |
SPD latency | 22 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Notebook |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
SPD profile | Yes |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
SPD speed | 3200 MHz |
Backlight | No |
SPD voltage | 1.2 V |
SPD latency | 22 |
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Notebook |
Memory form factor | 260-pin SO-DIMM |
CAS latency | 22 |
Memory voltage | 1.2 V |
SPD profile | Yes |
Cooling type | Heatsink |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Harmonized System (HS) code | 84733020 |
Other features |
---|
Harmonized System (HS) code | 84733020 |
£143.41
£119.51 In stock
-
Memory |
---|
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Origin Storage 2x32GB DDR4 3200MHz SODIMM 2Rx8 Non-ECC 1.2V Memory |
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Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
Features |
---|
Memory layout (modules x size) | 2 x 32 GB |
Internal memory | 64 GB |
Component for | Laptop |
Memory form factor | 260-pin SO-DIMM |
ECC | No |
Memory clock speed | 3200 MHz |
Internal memory type | DDR4 |
£133.96
£111.63 In stock
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