Name: Kingston Technology FURY 24GB 6400MT/s DDR5 CL32 DIMM Renegade RGB XMP
Brand: Kingston Technology
SKU: KF564C32RSA-24
Price: 114.52 GBP
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Kingston Technology FURY 24GB 7200MT/s DDR5 CL38 DIMM Renegade RGB XMP

£154.04

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Kingston Technology FURY 24GB 6400MT/s DDR5 CL32 DIMM Renegade Silver XMP

£109.79

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Kingston Technology FURY 24GB 7200MT/s DDR5 CL38 DIMM Renegade Silver XMP

£149.76

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Kingston Technology FURY 24GB 6400MT/s DDR5 CL32 DIMM Renegade RGB XMP

£114.52

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Special Deal

Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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Availability 132 In stock/77 sold

Free Standard Delivery or Express Delivery By Wednesday 3rd July

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Power
Memory voltage	1.45 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	44 mm
Depth	133.3 mm
Height	7.66 mm
Weight	56.5 g
Package weight	108.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	108.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.81 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	44 mm
Depth	133.3 mm
Height	7.66 mm
Weight	56.5 g
Package weight	108.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	108.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.81 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	48.5 g
Package weight	101.07 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	101.07 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.7 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	48.5 g
Package weight	101.07 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	101.07 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.7 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.45 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	1 x 24 GB
Internal memory	24 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	38
Memory voltage	1.45 V
Lead plating	Gold
Module configuration	3072M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	7200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	48.5 g
Package weight	101.07 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	101.07 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	1.7 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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