Name: Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 4266 MHz
Brand: Kingston Technology
SKU: KF442C19RBAK2/16
Price: 88.06 GBP
Availability: InStock

Kingston Technology ValueRAM 16GB(2 x 8GB) DDR3-1600 memory module 2 x 8 GB 1600 MHz

£81.65

RRP £112.95

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Kingston Technology System Specific Memory 16GB 1600MHz memory module 2 x 8 GB DDR3L

£84.14

RRP £119.91

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Kingston Technology KF316C10BK2/16 memory module 16 GB 2 x 8 GB DDR3 1600 MHz

£80.05

RRP £108.06

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Kingston Technology KF318LS11IBK2/16 memory module 16 GB 2 x 8 GB DDR3 1866 MHz

£86.38

RRP £108.69

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Kingston Technology KF316C10BBK2/16 memory module 16 GB 2 x 8 GB DDR3 1600 MHz

£80.05

RRP £109.40

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Kingston Technology KF318C10BBK2/16 memory module 16 GB 2 x 8 GB DDR3 1866 MHz

£80.05

RRP £95.39

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Kingston Technology FURY 16GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

£41.06

RRP £48.24

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Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 3600 MHz

£67.96

RRP £88.34

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Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 3200 MHz

£65.21

RRP £97.81

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Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 4000 MHz

£80.66

RRP £120.32

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Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 4600 MHz

£110.24

RRP £158.93

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Kingston Technology FURY Renegade RGB memory module 16 GB 2 x 8 GB DDR4 4266 MHz

£88.06

RRP £132.08

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Memory
Package type	DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Design
Product colour	Green
Technical details
Product colour	Green
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Weight & dimensions
Width	133.3 mm
Package type	DIMM
Packaging data
Package type	DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Memory
Package type	DIMM
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Power
Memory voltage	1.5 V
Design
Product colour	Green
Technical details
Product colour	Green
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.5 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1024M x 64
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
Weight & dimensions
Width	133.3 mm
Package type	DIMM
Packaging data
Package type	DIMM
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35,1.5,1.575 V
Design
Product colour	Black, Green
Technical details
Product colour	Black, Green
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Black, Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35,1.5,1.575 V
Design
Product colour	Black, Green
Technical details
Product colour	Black, Green
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Features
Buffered memory type	Unregistered (unbuffered)
Product colour	Black, Green
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	11
Memory voltage	1.35,1.5,1.575 V
Memory bus	64 bit
Lead plating	Gold
Module configuration	1G X 64
Row cycle time	28.125 ns
Refresh row cycle time	260 ns
Row active time	35 ns
Country of origin	Taiwan
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3L
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133.3 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Memory layout	2 x 8192 MB
Internal memory	16384 MB
Chips organisation	X8
Error indication	No
Country of origin	Taiwan
Bus clock rate	1600 MHz
Harmonized System (HS) code	84733020

Power
Memory voltage	1.5 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	10
Memory voltage	1.5 V
Module configuration	512M x 8
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	37.5 ns
Memory channels	Dual-channel
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
Features
Buffered memory type	Unregistered (unbuffered)
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	240-pin DIMM
CAS latency	10
Memory voltage	1.5 V
Module configuration	512M x 8
Row cycle time	48.125 ns
Refresh row cycle time	260 ns
Row active time	37.5 ns
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1600 MHz
Internal memory type	DDR3
JEDEC standard	Yes
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	133.3 mm
Depth	7.1 mm
Height	34 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.35,1.5 V
Design
Backlight	No
Cooling type	Heatsink
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Memory channels	Dual-channel
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Features
Intel Extreme Memory Profile (XMP)	No
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	204-pin SO-DIMM
CAS latency	11
Memory voltage	1.35,1.5 V
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Memory channels	Dual-channel
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	1866 MHz
Internal memory type	DDR3
Harmonized System (HS) code	84733020
System requirements
Windows operating systems supported	Yes
Linux operating systems supported	Yes
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Width	97.6 mm
Height	30 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.35 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
ECC	No
Memory clock speed	3600 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.35 V
Lead plating	Gold
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	3600 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Width	133.3 mm
Depth	8.3 mm
Height	42.2 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.4 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Memory clock speed	4266 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 8 GB
Internal memory	16 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	19
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	1024M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	Taiwan
Cooling type	Heatsink
ECC	No
Memory clock speed	4266 MHz
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Operational conditions
Operating temperature (T-T)	0 - 70 °C
Storage temperature (T-T)	-40 - 85 °C
Weight & dimensions
Width	133.3 mm
Depth	8.3 mm
Height	42.2 mm
Logistics data
Harmonized System (HS) code	84733020
Other features
Country of origin	Taiwan
Harmonized System (HS) code	84733020

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Memory Modules

Best Selling Product

Tracking Information