Name: Kingston Technology ValueRAM KVR56U46BD8K2-96 memory module 96 GB 2 x 48 GB DDR5
Brand: Kingston Technology
SKU: KVR56U46BD8K2-96
Price: 253.92 GBP
Availability: InStock

Kingston Technology FURY 96GB 6000MT/s DDR5 CL32 DIMM (Kit of 2) Renegade Silver XMP

£312.50

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Kingston Technology FURY 96GB 6400MT/s DDR5 CL32 DIMM (Kit of 2) Renegade Silver XMP

£382.93

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Kingston Technology FURY 96GB 6400MT/s DDR5 CL32 DIMM (Kit of 2) Renegade RGB XMP

£391.97

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Kingston Technology FURY 96GB 6000MT/s DDR5 CL32 DIMM (Kit of 2) Renegade RGB XMP

£321.30

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Kingston Technology ValueRAM KVR56S46BD8K2-96 memory module 96 GB 2 x 48 GB DDR5

£253.92

RRP £347.02

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Kingston Technology ValueRAM KVR56U46BD8K2-96 memory module 96 GB 2 x 48 GB DDR5

£253.92

RRP £327.98

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Thermaltake 27inch Flat Gaming Monitor - UK

27inch Flat Gaming Monitor - UK

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SKU : GM-GFT-27FTQB-UK
Part Number :
Manufacture : Thermaltake

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	97 g
Package weight	149.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	149.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.43 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6000 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	97 g
Package weight	149.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	149.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.43 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	97 g
Package weight	149.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	149.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.43 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight	No
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	39.2 mm
Depth	133.3 mm
Height	7.65 mm
Weight	97 g
Package weight	149.84 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	149.84 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.43 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.4 V
Design
Backlight colour	Red/Green/Blue
Backlight	Yes
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	38 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Backlight colour	Red/Green/Blue
Backlight	Yes
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	32
Memory voltage	1.4 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	38 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Width	44 mm
Depth	133.3 mm
Height	7.66 mm
Weight	113 g
Package weight	165.62 g
Packaging data
Package width	122.2 mm
Package depth	17.3 mm
Package height	171.5 mm
Package weight	165.62 g
Logistics data
Master (outer) case width	190.5 mm
Master (outer) case length	254 mm
Master (outer) case height	177.8 mm
Master (outer) case gross weight	2.67 kg
Products per master (outer) case	15 pc(s)
Other features
Country of origin	China, Taiwan

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Power
Memory voltage	1.1 V
Design
JEDEC standard	Yes
Memory
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Memory layout (modules x size)	2 x 48 GB
Internal memory	96 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	46
Memory voltage	1.1 V
Lead plating	Gold
Module configuration	6144M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Technical details
Doesn't contain	Halogen
Sustainability
Doesn't contain	Halogen
Weight & dimensions
Width	69.6 mm
Height	30 mm

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