Name: Kingston Technology 64GB DDR5-4800MT/S SODIMM (KIT OF 2) memory module 2 x 32 GB 4800 MHz
Brand: Kingston Technology
SKU: KCP548SD8K2-64
Price: 176.8 GBP
Availability: InStock

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Kingston Technology FURY 64GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

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Kingston Technology FURY 64GB 3200MT/s DDR4 CL16 DIMM (Kit of 2) Beast Black

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Kingston Technology FURY Impact Black memory module 32 GB 2 x 32 GB DDR5 2400 MHz

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Kingston Technology FURY Impact Black memory module 64 GB 2 x 32 GB DDR5 2400 MHz

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Kingston Technology ValueRAM KVR48U40BD8K2-64 memory module 64 GB 2 x 32 GB DDR5 4800 MHz

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Kingston Technology FURY Beast 64GB 5600MT/s DDR5 CL40 DIMM (Kit of 2) Black

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Kingston Technology ValueRAM KVR48S40BD8K2-64 memory module 64 GB 2 x 32 GB DDR5 4800 MHz

£170.05

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Kingston Technology FURY Beast 64GB 4800MT/s DDR5 CL38 DIMM (Kit of 2) Black

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Kingston Technology FURY Beast 64GB 5200MT/s DDR5 CL40 DIMM (Kit of 2) Black

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Kingston Technology KCP548UD8K2-64 memory module 64 GB 2 x 32 GB DDR5 4800 MHz

£176.80

RRP £241.63

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Kingston Technology 64GB DDR5-4800MT/S SODIMM (KIT OF 2) memory module 2 x 32 GB 4800 MHz

£176.80

RRP £235.73

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Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Cooling type	Heatsink
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	16
Memory voltage	1.2 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	7.1 mm
Depth	113.4 mm
Height	34 mm
Weight	72.1 g
Package weight	96.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	96.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.63 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.1 V
Technical details
Country of origin	China, Taiwan
Memory
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 32 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	2400 MHz
Internal memory type	DDR5
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 32 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Country of origin	China, Taiwan
Memory ranking	1
ECC	No
Memory clock speed	2400 MHz
Internal memory type	DDR5
Memory data transfer rate	4800 MT/s
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.25 V
Design
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	3.0
Memory layout (modules x size)	2 x 32 GB
Internal memory	64 GB
Component for	PC/Server
Memory form factor	288-pin DIMM
CAS latency	40
Memory voltage	1.25 V
Lead plating	Gold
Module configuration	4096M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	5600 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	6.6 mm
Depth	133.4 mm
Height	34.8 mm
Weight	77.1 g
Package weight	101.7 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	101.7 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	2.75 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Memory Modules

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Tracking Information