Name: Kingston Technology FURY 32GB 6400MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP
Brand: Kingston Technology
SKU: KF564S38IBK2-32
Price: 139.78 GBP
Availability: InStock

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Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact

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Kingston Technology FURY 32GB 2666MT/s DDR4 CL15 SODIMM (Kit of 2) 1Gx8 Impact

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Kingston Technology FURY Impact Black memory module 32 GB 2 x 16 GB DDR5 2400 MHz

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Kingston Technology ValueRAM KVR48S40BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz

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Kingston Technology KCP548SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 4800 MHz

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Kingston Technology FURY 32GB 5600MT/s DDR5 CL40 SODIMM (Kit of 2) Impact PnP

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Kingston Technology KCP552SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5200 MHz

£101.57

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Kingston Technology KCP556SS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5600 MHz

£129.26

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Kingston Technology ValueRAM KVR52S42BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5200 MHz

£101.42

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Kingston Technology ValueRAM KVR56S46BS8K2-32 memory module 32 GB 2 x 16 GB DDR5 5600 MHz

£104.21

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Kingston Technology FURY 32GB 6400MT/s DDR5 CL38 SODIMM (Kit of 2) Impact XMP

£139.78

RRP £188.69

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Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	16
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	20
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45.75 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	3200 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

Power
Memory voltage	1.2 V
Design
Backlight	No
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
Features
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
Intel Extreme Memory Profile (XMP) version	2.0
Backlight	No
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	260-pin SO-DIMM
CAS latency	15
Memory voltage	1.2 V
Module configuration	2048M x 64
Row cycle time	45 ns
Refresh row cycle time	350 ns
Row active time	26.25 ns
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	2
ECC	No
Internal memory type	DDR4
Programming power voltage (VPP)	2.5 V
JEDEC standard	Yes
Harmonized System (HS) code	84733020
Memory data transfer rate	2666 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	15.2 g
Package weight	40.3 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	40.3 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.22 kg
Products per master (outer) case	25 pc(s)
Harmonized System (HS) code	84733020
Other features
Country of origin	China, Taiwan
Harmonized System (HS) code	84733020

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Power
Memory voltage	1.1 V
Technical details
Country of origin	China, Taiwan
Memory
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Memory ranking	1
ECC	No
Memory clock speed	2400 MHz
Internal memory type	DDR5
Features
On-Die ECC	Yes
Intel Extreme Memory Profile (XMP)	Yes
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	40
Memory voltage	1.1 V
Country of origin	China, Taiwan
Memory ranking	1
ECC	No
Memory clock speed	2400 MHz
Internal memory type	DDR5
AMD Extended Profiles for Overclocking (EXPO)	Yes
Memory data transfer rate	4800 MT/s
Other features
Country of origin	China, Taiwan

Power
Memory voltage	1.35 V
Design
Product colour	Black
Cooling type	Heatsink
JEDEC standard	Yes
Technical details
Product colour	Black
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
Features
On-Die ECC	Yes
Buffered memory type	Unregistered (unbuffered)
Intel Extreme Memory Profile (XMP)	Yes
SPD speed	4800 MHz
Intel Extreme Memory Profile (XMP) version	3.0
SPD voltage	1.1 V
SPD latency	39
Product colour	Black
Memory layout (modules x size)	2 x 16 GB
Internal memory	32 GB
Component for	Laptop
Memory form factor	262-pin SO-DIMM
CAS latency	38
Memory voltage	1.35 V
Lead plating	Gold
Module configuration	2048M x 64
Row cycle time	48 ns
Refresh row cycle time	295 ns
Row active time	32 ns
SPD profile	Yes
Memory channels	Dual-channel
Country of origin	China, Taiwan
Cooling type	Heatsink
Memory ranking	1
ECC	No
Internal memory type	DDR5
Programming power voltage (VPP)	1.8 V
JEDEC standard	Yes
Memory data transfer rate	6400 MT/s
Operational conditions
Operating temperature (T-T)	0 - 85 °C
Storage temperature (T-T)	-55 - 100 °C
Weight & dimensions
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Width	3.8 mm
Depth	69.6 mm
Height	30 mm
Weight	17.77 g
Package weight	42.69 g
Packaging data
Package width	95.3 mm
Package depth	14 mm
Package height	171.5 mm
Package weight	42.69 g
Logistics data
Master (outer) case width	203.2 mm
Master (outer) case length	311.2 mm
Master (outer) case height	101.6 mm
Master (outer) case gross weight	1.28 kg
Products per master (outer) case	25 pc(s)
Other features
Country of origin	China, Taiwan

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Memory Modules

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Tracking Information