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Memory Modules
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| Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
Kingston Technology KCP432SD8/32 memory module 32 GB 1 x 32 GB DDR4 3200 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Memory |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Features |
|---|
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Memory ranking | 2 |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Harmonized System (HS) code | 84733020 |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Harmonized System (HS) code | 84733020 |
£70.60
£58.83 In stock
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![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | Taiwan |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | Taiwan |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Depth | 3.7 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology ValueRAM KVR32S22D8/32 memory module 32 GB 1 x 32 GB DDR4 3200 MHz | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | Taiwan |
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Compliance certificates | RoHS |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 22 |
| Memory voltage | 1.2 V |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 32 ns |
| Country of origin | Taiwan |
| ECC | No |
| Memory clock speed | 3200 MHz |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Sustainability |
|---|
| Sustainability certificates | RoHS |
| Doesn't contain | Halogen |
| Weight & dimensions |
|---|
| Width | 69.6 mm |
| Depth | 3.7 mm |
| Height | 30 mm |
| Logistics data |
|---|
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | Taiwan |
| Harmonized System (HS) code | 84733020 |
£65.98
£54.98 In stock
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| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM (Kit of 2) Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Backlight | No |
| Cooling type | Heatsink |
| JEDEC standard | Yes |
| Technical details |
|---|
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Backlight | No |
| Memory layout (modules x size) | 2 x 16 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 2048M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 1 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| JEDEC standard | Yes |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 15.2 g |
| Package weight | 40.3 g |
| Packaging data |
|---|
| Package width | 95.3 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 40.3 g |
| Logistics data |
|---|
| Master (outer) case width | 203.2 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 101.6 mm |
| Master (outer) case gross weight | 1.22 kg |
| Products per master (outer) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£68.69
£57.24 In stock
-
![]()
| Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
Kingston Technology FURY 32GB 3200MT/s DDR4 CL20 SODIMM Impact | Power |
|---|
| Memory voltage | 1.2 V |
| Design |
|---|
| Product colour | Black |
| Cooling type | Heatsink |
| Technical details |
|---|
| Product colour | Black |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Features |
|---|
| Buffered memory type | Unregistered (unbuffered) |
| Intel Extreme Memory Profile (XMP) | Yes |
| Intel Extreme Memory Profile (XMP) version | 2.0 |
| Product colour | Black |
| Memory layout (modules x size) | 1 x 32 GB |
| Internal memory | 32 GB |
| Component for | Laptop |
| Memory form factor | 260-pin SO-DIMM |
| CAS latency | 20 |
| Memory voltage | 1.2 V |
| Module configuration | 4096M x 64 |
| Row cycle time | 45.75 ns |
| Refresh row cycle time | 350 ns |
| Row active time | 26.25 ns |
| Country of origin | China, Taiwan |
| Cooling type | Heatsink |
| Memory ranking | 2 |
| ECC | No |
| Internal memory type | DDR4 |
| Programming power voltage (VPP) | 2.5 V |
| Harmonized System (HS) code | 84733020 |
| Memory data transfer rate | 3200 MT/s |
| Operational conditions |
|---|
| Operating temperature (T-T) | 0 - 85 °C |
| Storage temperature (T-T) | -55 - 100 °C |
| Weight & dimensions |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Width | 3.8 mm |
| Depth | 69.6 mm |
| Height | 30 mm |
| Weight | 7.6 g |
| Package weight | 25.4 g |
| Packaging data |
|---|
| Package width | 57.2 mm |
| Package depth | 14 mm |
| Package height | 171.5 mm |
| Package weight | 25.4 g |
| Logistics data |
|---|
| Master (outer) case width | 196.9 mm |
| Master (outer) case length | 311.2 mm |
| Master (outer) case height | 61 mm |
| Master (outer) case gross weight | 780.5 g |
| Products per master (outer) case | 25 pc(s) |
| Shipping (inner) case width | 19.7 cm |
| Shipping (inner) case length | 31.1 cm |
| Shipping (inner) case height | 6.1 cm |
| Products per shipping (inner) case | 25 pc(s) |
| Harmonized System (HS) code | 84733020 |
| Other features |
|---|
| Country of origin | China, Taiwan |
| Harmonized System (HS) code | 84733020 |
£67.62
£56.35 In stock
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